| No. | Brand | G | J | C | S | b | e | H | L |
| SP8266 | - | - | - | - | - | - | - | - | - |
| SPW20N60C3 | - | - | - | - | - | 12.2 mm | 0.25 | - | - |
| SP30L | INA | - | - | - | - | - | - | - | - |
| 100% | INA | - | - | - | - | - | - | - | - |
| NRF52840-QIAA | - | - | - | - | - | - | - | - | - |
| SPHE8203R | INA | - | - | - | - | - | - | - | - |
| LM4120AIM5X-2.0 | - | - | - | - | - | - | - | - | - |
| PIC16F722-/ML | INA | - | - | - | - | - | - | - | - |
| LV25-P | INA | - | - | - | - | - | - | - | - |
| HTU20 | - | - | - | - | - | - | - | - | - |
| HU2001R2 | INA | - | - | - | - | - | - | - | - |
| BCM5751FKFB | - | - | - | - | - | - | - | - | - |
| SPW20N60S5 | - | - | - | - | - | - | 8.4 mm | 81 mm | 58.7 mm |
| MAX30102 | - | - | - | - | - | - | - | - | - |
| SPV1001N30 | - | M6x1 | 110 mm | - | - | - | 11 mm | - | - |
| PIC18F2410-I/SP | - | - | - | - | - | - | - | - | - |
| 47N60C3 | - | - | - | - | - | - | - | - | - |
| 42HB34F08AB | - | - | - | - | - | - | 0.24 | - | - |
| SDV2012A260C251NPTF | INA | - | - | - | - | - | - | - | - |
| SPN1001-FV1 | INA | - | - | - | - | - | - | - | - |
| AN28F010 | - | - | - | - | - | - | - | - | - |
| SP6201EM5-L-3-3/TR | INA | - | - | - | - | - | - | - | - |
| 5-14GHz | - | - | - | - | - | - | - | - | - |
| PIC18F26K22-I/SP | - | - | - | 33.5 kN | 18.3 mm | - | - | - | - |
| MCP42100-I/SL | - | - | - | - | - | - | 0.22 | - | - |
| SPX5205M5-L-5-0/TR | - | - | - | - | - | - | - | - | - |
| TLE7209-2R | INA | - | 99 mm | - | - | - | 16 mm | - | - |
| PIC18F25Q10-I/SP | - | R1/8" | - | - | - | - | - | 78 mm | - |
| PIC18F26K22-I/SP PIC18F26K22-E/SP PIC18F26K22 DIP-28 High-Performance Microcontrollers | B1:51.6 mm; Designation of housing:C307-; T min.:-40 °C; A3:3 mm; SW:3.97 mm; C:33.5 kN; A:32 mm; d1:55 mm; Recommended tightening torque for set screw:8 Nm; S:18.3 mm; |
| Effect MOS transistor SPW20N60S5 | d:15 mm; s1:11 mm; Weight:0.28 kg; L:58.7 mm; H:81 mm; e:8.4 mm; N1:M6; T min.:-20 °C; T max.:100 °C; C0:4.78 kN; |
| 47N60C3 SPW47N60C3 TO247 BOM List Electronic Components Integrated Circuits MOSFET Transistor 47N60C3 | Width T(mm):35; Flange Shape:Compact Type; Seals:DD (Contact Rubber S; Bearing Used:Deep Groove Ball Bea; Bearing Material:[Steel] Steel; Number of Bearings:Double; Holder Surface Treatment:Electroless Nickel P; Type:Bearings with Housin; Volume Discount:Available; Housing Material:1045 Carbon Steel; |
| Jeking SP8266 IC ESP8266MOD Serial Wifi Module | da max:50.3 mm; Brand:SNR; Max operating temperature, Tmax:120 °C; Characteristic inner ring frequency, BPFI:5.39 Hz; Characteristic outer ring frequency, BPF0:3.61 Hz; D:80 mm; Characteristic cage frequency, FTF:0.4 Hz; Min operating temperature, Tmin:-20 °C; da min:46.5 mm; B:18 mm; |
| Integrated Circuits PIC18F2410-I/SP | EAN:4547359547801; Inventory:0.0; da max:47 mm; Rolling Element:Ball Bearing; Enclosure Type:Contact Seal; f0:15.2; Precision Class:ABEC 1 | ISO P0; Internal Clearance:C3-Loose; Static load, C0:11.5 kN; Keyword String:Ball; |
| good quality IC SENSOR OXIMETER/HEARTRATE MAX30102 | Bearing Used:Deep Groove Ball Bea; Flange Shape:Compact Type; Holder Surface Treatment:Electroless Nickel P; Type:Bearings with Housin; Housing Material:1045 Carbon Steel; Bearing Material:[Steel] Steel; Width T(mm):14; Days to Ship:7 Days; Number of Bearings:Single; |
| Integrated Circuits Chip LM4120AIM5X-2.0 SOT-23 | Surface Treatment:No; d:75; Pillow Type, Category:Standard; Diameter series symbol:For Heavy Load; Bearing Inner Dia. Shape:Cylindrical Bore Set; Seal:Silicone; Fit:J7; Unit Body Material:Cast Iron; Machining:No; Days to Ship:8 Days; |
| PIC18F25Q10-I/SP (Supply Electronic Components Chip Microcontrollers Support IC BOM) | d1:37.4 mm; A:21 mm; Designation of bearing:ES205-15G2; G:R1/8"; SW:3.18 mm; Recommended tightening torque for set screw:3.7 Nm; H:78 mm; s1:24.2 mm; T min.:-20 °C; C0:7.88 kN; |
| SDV2012A260C251NPTF IC Chips New Original High Quality Chips High Quality Electronic Components (Original in Stock) | Rolling Element Material:Steel; Precision:Grade 0; Bearing Style:Rubber Sealed; B:27; Type:Ball; Days to Ship:6 Days; Specifications/Environment:Standard; Seal, Shield Symbols:LLB; Retainer Type:Punching; Preload Mark:CM; |
| New original integrated circuit SPHE8203R SPHE8203S SPHE8203A QFP | Bearing Used:Deep Groove Ball Bea; Shape:Flanged Pilot Type; Flange Shape:Square Type; Volume Discount:Available; RoHS:6; Bearing Retained:Yes (with retaining; Housing Material:1045 Carbon Steel; Flange O.D. H(φ):50; Number of Bearings:Double; |
Component Field-Effect Transistor SPW20N60C3 Video