| No. | Brand | G | J | C | S | b | e | H | L |
| SP30L | INA | - | - | - | - | - | - | - | - |
| BCM5751FKFB | - | - | - | - | - | - | - | - | - |
| WTR2605 | INA | - | - | - | - | - | - | - | - |
| 100% | INA | - | - | - | - | - | - | - | - |
| SPW20N60S5 | - | - | - | - | - | - | 8.4 mm | 81 mm | 58.7 mm |
| SP6201EM5-L-3-3/TR | INA | - | - | - | - | - | - | - | - |
| SPX5205M5-L-5-0/TR | - | - | - | - | - | - | - | - | - |
| 5-14GHz | - | - | - | - | - | - | - | - | - |
| SPHE8203R | INA | - | - | - | - | - | - | - | - |
| SPV1001N30 | - | M6x1 | 110 mm | - | - | - | 11 mm | - | - |
| SDV2012A260C251NPTF | INA | - | - | - | - | - | - | - | - |
| PIC16F722-/ML | INA | - | - | - | - | - | - | - | - |
| TLE7209-2R | INA | - | 99 mm | - | - | - | 16 mm | - | - |
| PIC18F26K22-I/SP | - | - | - | 33.5 kN | 18.3 mm | - | - | - | - |
| MCP42100-I/SL | - | - | - | - | - | - | 0.22 | - | - |
| MAX30102 | - | - | - | - | - | - | - | - | - |
| 47N60C3 | - | - | - | - | - | - | - | - | - |
| LV25-P | INA | - | - | - | - | - | - | - | - |
| PIC18F2410-I/SP | - | - | - | - | - | - | - | - | - |
| HU2001R2 | INA | - | - | - | - | - | - | - | - |
| SPN1001-FV1 | INA | - | - | - | - | - | - | - | - |
| PIC18F25Q10-I/SP | - | R1/8" | - | - | - | - | - | 78 mm | - |
| SSOP20 | - | - | - | - | - | - | - | - | - |
| 42HB34F08AB | - | - | - | - | - | - | 0.24 | - | - |
| AN28F010 | - | - | - | - | - | - | - | - | - |
| WS2812B | - | R1/8" | - | 14 kN | 7.5 mm | - | - | - | - |
| SDV2012A260C251NPTF IC Chips New Original High Quality Chips High Quality Electronic Components (Original in Stock) | Rolling Element Material:Steel; Precision:Grade 0; Bearing Style:Rubber Sealed; B:27; Type:Ball; Days to Ship:6 Days; Specifications/Environment:Standard; Seal, Shield Symbols:LLB; Retainer Type:Punching; Preload Mark:CM; |
| Integrated Circuits Chip LM4120AIM5X-2.0 SOT-23 | Surface Treatment:No; d:75; Pillow Type, Category:Standard; Diameter series symbol:For Heavy Load; Bearing Inner Dia. Shape:Cylindrical Bore Set; Seal:Silicone; Fit:J7; Unit Body Material:Cast Iron; Machining:No; Days to Ship:8 Days; |
| (Electronic Components) 100% New NH82801GB SL8FX BGA Chipset new and original | Flange O.D. H(φ):77; Bearing Material:Stainless Steel; RoHS:6; Volume Discount:Available; Flange Shape:Square Type; Holder Surface Treatment:Not Provided; Width T(mm):18; Bearing Retained:Yes (with retaining; Housing Material:304 Stainless Steel; |
| SSOP20 2.8V-5.5V Support DAC/PWM Plug-in SPI-FLASH Voice IC Chip WT588D WT588D-20SS | Bearing Used:Deep Groove Ball Bea; Volume Discount:Available; Number of Bearings:Double; Days to Ship:7 Days; Shape:Flange Type; Bearing Retained:No; Seals:ZZ (Double Shield); Type:Bearings with Housin; |
| PIC18F26K22-I/SP PIC18F26K22-E/SP PIC18F26K22 DIP-28 High-Performance Microcontrollers | B1:51.6 mm; Designation of housing:C307-; T min.:-40 °C; A3:3 mm; SW:3.97 mm; C:33.5 kN; A:32 mm; d1:55 mm; Recommended tightening torque for set screw:8 Nm; S:18.3 mm; |
| LA55-P/SP1 LA55-P In Stock CURRENT HALL 50A AC/DC Closed Loop Bidirectional Module SENSOR | G:M6x1; T max.:100 °C; A2:40.2 mm; T min.:-20 °C; d:41.28 mm; H3:105; e:10 mm; B:49.2 mm; S:19 mm; Weight:2.66 kg; |
| Mobilephone RF Chip WTR2605 New Original | Seals:ZZ (Double Shield); RoHS:6; Volume Discount:Available; Housing Material:304 Stainless Steel; Number of Bearings:Double; Flange Shape:Compact Type; Bearing Used:Deep Groove Ball Bea; Shape:Flange Type; Holder Width(inch):2; |
| 47N60C3 SPW47N60C3 TO247 BOM List Electronic Components Integrated Circuits MOSFET Transistor 47N60C3 | Width T(mm):35; Flange Shape:Compact Type; Seals:DD (Contact Rubber S; Bearing Used:Deep Groove Ball Bea; Bearing Material:[Steel] Steel; Number of Bearings:Double; Holder Surface Treatment:Electroless Nickel P; Type:Bearings with Housin; Volume Discount:Available; Housing Material:1045 Carbon Steel; |
| Jeking SP8266 IC ESP8266MOD Serial Wifi Module | da max:50.3 mm; Brand:SNR; Max operating temperature, Tmax:120 °C; Characteristic inner ring frequency, BPFI:5.39 Hz; Characteristic outer ring frequency, BPF0:3.61 Hz; D:80 mm; Characteristic cage frequency, FTF:0.4 Hz; Min operating temperature, Tmin:-20 °C; da min:46.5 mm; B:18 mm; |
| TLE7209-2R TLE7209 IC MOTOR DRIVER SPI HSOP20 original | J:99 mm; Designation of housing:FL205-; Designation of bearing:EX205-16G2T20; B1:44.3 mm; Weight:0.64 kg; A:27 mm; T max.:200 °C; T min.:-20 °C; d:25.4 mm; e:16 mm; |
Integrated Circuits Chip Electron Components BCM5751FKFB P21 Video